Background
PhD // ECE // Dartmouth, Oct '21
BE // BME // Dartmouth, Mar '17
MBA // Quantic, Expected Oct '25
GED // High School Dropout, May '12
BE // BME // Dartmouth, Mar '17
MBA // Quantic, Expected Oct '25
GED // High School Dropout, May '12
Dr. Lee received his PhD in ECE with a focus on Electronic Materials & Devices in Oct '21 from Dartmouth College at the age of 26. He was a DOE NNSA LRGF Fellow with Los Alamos National Laboratory and pioneered the concept of photon energy attenuation layers (PAL), a new competitor to conventional scintillators, which can dramatically enhance high-energy X-ray signals on semiconductor devices such as Si CMOS image sensors (CIS) as one of the many ongoing stockpile stewardship projects for the DMMSC / MaRIE facility.
In parallel, Dr. Lee also studied solar-selective absorbers for his doctoral dissertation work. As an undergraduate, he was trained as a biomedical device engineer and took part in inventing a novel cerebral shunt valve for hydrocephalus treatment.
Dr. Lee has worked with Applied Materials during grad school to develop directional dry etch processes and later on returned full-time to drive PECVD projects for advanced logic and memory devices, where many of the processes he developed are now or will be under production for 3D NAND, DRAM, and Logic.
As of July 2023, he joined Samsung, where he is now working at the intersection of talent acquisition and technology strategy as a general technology specialist to engage with key thought leaders & build network with exceptional talent as they are the most critical next-generation technological assets.
He is also a high school dropout.
In parallel, Dr. Lee also studied solar-selective absorbers for his doctoral dissertation work. As an undergraduate, he was trained as a biomedical device engineer and took part in inventing a novel cerebral shunt valve for hydrocephalus treatment.
Dr. Lee has worked with Applied Materials during grad school to develop directional dry etch processes and later on returned full-time to drive PECVD projects for advanced logic and memory devices, where many of the processes he developed are now or will be under production for 3D NAND, DRAM, and Logic.
As of July 2023, he joined Samsung, where he is now working at the intersection of talent acquisition and technology strategy as a general technology specialist to engage with key thought leaders & build network with exceptional talent as they are the most critical next-generation technological assets.
He is also a high school dropout.
Current Technical Interests
- Next generation DRAM, Flash Memory, Logic devices
- Advanced packaging technologies
- AI/ML, CVML
- Cloud computing
- Advanced display technologies
- All-solid-state batteries & beyond